1. Gadziriro yeSubstrate: Sarudza-mhando yepamusoro FR4 PCB substrate sechikamu chepasi.
2. Kurapa Kwepamusoro: Kucheka, kuchera, kupenya kwemakemikari, nezvimwewo.
3. Adhesive Printing: Dhinda inonamira layer paPCB surface uchishandisa silkscreen kana screen printing.
4. Insertion: Isa zvinhu zvemagetsi pane adhesive layer maererano neSMD pattern.
5. Kurapa: Shandisa mwenje weUV kuti uchengetedze ganda rekunamatira uye zvikamu zvemagetsi kuPCB pamusoro.
6. Surface Coating: Shandisa muchina wekupfapfaidza wekupfapfaidza kuisa anti-oxidation layer panzvimbo yePCB kudzivirira kuokisisa nekuora.
